Work Envelope: Rec. 2.5 x 2.5 x 3 in / Cylinder 3 in dia. x 3 in tall
Scalable to various platforms* Mini Mill 16 x 12 x 10 in Drill Mill 20 x 16 x 15.5 in VF-2 30 x 16 x 20 in
*Work envelope based on 3-axis system
Basic Functions
Syringe Printed Electronics (PE) Metal Fused Deposition Model (FDM) Micro Machining (MM) 3-axis or 5-axis Computer Numeric Control (CNC) Electronic Packaging (EP)
Vertical Divider
Custom Tool Options
Aerosol Printing
Aerosol printer head jets aerosolized nanomaterial ink with great precision, generating 2-4 times higher print resolution than inkjets. The distance between the print head and substrate can be varied, unlike in syringe printing.
Selective Laser Sintering/Curing
High power laser selectively fuses small particles in a powder bed, reducing need for support structures while manufacturing
Laser Machining
Subtractive manufacturing that uses lasers to cut away and remove build material
UV Curing
(In-situ or Ex-situ) Polymerization for UV-curable polymer printing
Fused Deposition Modeling (FDM)
Build material is heated to melting temperature and extruded out a nozzle head onto build table
Component Pick-and-Place (PnP)
Locate surface mount components onto a circuit board